A research team led by Prof. ZHANG Shihua from the Academy of Mathematics and Systems Science has proposed a new computational tool, STAGATE, to decipher tissue substructures from spatial resolved transcriptomics. The model uses artificial intelligence technology to integrate spatial location information and gene expression profile of spatial spots. In this algorithm, a graph attention autoencoder is introduced, with a graph attention mechanism in the middle hidden layer, which can learn the heterogeneous similarities between neighboring spots adaptively.
Prof. CHEN Shibing from University of Science and Technology of China (USTC) of the Chinese Academy of Sciences and his collaborators have studied the global regularity for the Monge-Ampère equation with natural boundary condition.
To reinvestigate isomer depletion, researchers at the Institute of Modern Physics (IMP) and their collaborators used an isomer beam to avoid contamination from the heavy gamma background. The experiment was conducted at RIBLL, which is housed at the Heavy Ion Research Facility in Lanzhou.
Researchers from University of Science and Technology of China have realized quantum amplification in a Floquet system based on xenon noble gas. The Floquet system can extend the operation bandwith of quantum amplification, and can enhance several signals simultaneously. This result has wide applications in the research of fundamental physics.
Researchers developed a new water decontamination technology, the direct oxidative transfer process (DOTP). In DOPT, a direct redox reaction between pollutants and oxidants occurred on the catalyst surface. Products formed were stabilized and spontaneously underwent surface polymerization or coupling reaction. As a result, products accumulated on the catalyst surface, contributing to the effective elimination of aquatic pollutants.
A research team led by Prof. YUAN Daqiang from Fujian Institute of Research on the Structure of Matter, in collaboration with Prof. ZHAO Dan, from National University of Singapore (NUS), reviewed the synthesis and application of Zr-MOCs and systematically summarized their assembly rules in addition to their elaborated-related synthesis methods and strategies.
In a recent study, Prof. YANG Wenqiang's research team from the Institute of Botany of the Chinese Academy of Sciences (IBCAS) has reported the critical role of the largest protein Orf2971 encoded by the Chlamydomonas reinhardtii plastid genome in protein translocation and quality control.
Researchers from the Wuhan Botanical Garden, together with collaborators from Wuhan University, have addressed this research gap by investigating the adsorption behavior of copper ions on different-sized polyethylene and their combined effects on four submerged macrophytes species. Adsorption tests, batch experiments on combined effect of microplastics and copper ions were conducted.
Researchers led by Prof. QIN Boqiang from the Nanjing Institute of Geography and Limnology revealed why shallow lakes are prone to eutrophication.
Researchers from China, the USA and the Netherlands are exploring to use observational and modelling data to better understand the Third Pole of the world.
Researchers from the Shenzhen Institute of Advanced Technology proposed a low-time-cost automatic configuration optimization method named Low-Overhead Online Configuration Auto-Tuning, which could reduce the optimization time and improve performance of Spark SQL.
A research team from the Hefei Institutes of Physical Science (HFIPS) has recently developed a new algorithm for near-infrared spectroscopy technology to improve the transfer efficiency of near-infrared qualitative analysis models between instruments.
A research team led by Prof. ZENG Yi from the Institute of Automation has proposed backpropagation with biologically plausible spatiotemporal adjustment for training deep spiking neural networks.
A research group led by Prof. CHEN Chilai from the Hefei Institutes of Physical Science has developed Through Glass Via process for three dimensional (3D) advanced packaging, enabling low transmission loss and high vacuum wafer-level packaging of high-frequency chips and Microelectro Mechanical Systems (MEMS) sensors.
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