Researchers at the CAS Institute of Chemistry (ICCAS) have made breakthrough progress in developing the manufacturing technology of advanced polymer materials for microelectronics packaging applications. The advanced integrated circuit (IC) packaging polymer materials, including photoimageable polyimide resins and liquid epoxy underfills, are the key issue for FC-BGA/CSP(flip chip-ball grill array/chip scale packaging) which is the main stream for the next generation of microelectronics devices. With the down-sizing, thinning and high I/O (input/output) of IC chips, microelectronics packaging has faced a big challenge in technology.
The achievement is scored by a research team headed by Prof. Yang Shiyong of the Laboratory of Advanced Polymer Materials at ICCAS. Under the financial support of the National 863 Program for Hi-tech Development from the Chinese Ministry of Science & Technology, the research group has developed the proprietary technology for production of photoimageable polyimide resins, including inherent photosensitive PI resins (BTPA-1000 series) and standard PI resins (BTDA-1000 series). The photoimageable polyimide resins are currently employed as interlayer dielectrics in multilayer structure of IC manufacturing process, buffer and protection coating in IC packaging, and insulating resins in IC packaging substrate, etc.
The novel liquid epoxy underfills (UFEP-1000 series) are the critical materials for packaging of FC-BGA and FC-CSP, which are employed for underfilling of the gap formed by the eutectic ball between the IC chip and the substrate in order to enhance the mechanical strength and to protect the IC chips from moisture attacks. The epoxy underfills, with high filler-loading and low viscosity as well as good storage stability, could thermally rapid-cured to give cured resin with excellent thermal stability and mechanical properties, low thermal coefficient of expansion and moisture uptakes.
According to scientists, the progress in the microelectronic packaging materials will lay a basic materials foundation for the advanced microelectronic industry in China.
